Header assembly for mounting to a circuit substrate

Details Header assembly for mounting to a circuit substrate Header assembly for mounting to a circuit substrate

H - Electricity

01

R

H01R 13/648 (2006.01) H01R 33/94 (2006.01) H01R 12/16 (2006.01)

Patent

CA 2590544

The present invention relates to a header comprising a body, a plurality of signal pins extending from the body, and a plurality of generally L-shaped ground shields within the body. Each ground shield is associated with a corresponding one of the signal pins. The present invention also relates to a header comprising a body, a plurality of ground shields in the body, a plurality of receiving areas located between adjacent ground shields, a plurality of ground pins and a plurality of conductive elements. The plurality of ground pins extend through the body and each have a longitudinal portion generally offset from the receiving area. The plurality of conductive elements are each disposed within the receiving area for connecting a corresponding one of the ground pins to a corresponding one of the ground shields.

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