Hearing instrument hybrids incorporating edge metallization

Details Hearing instrument hybrids incorporating edge metallization Hearing instrument hybrids incorporating edge metallization

H - Electricity

05

K

H05K 1/02 (2006.01) H04R 25/00 (2006.01) H05K 3/40 (2006.01) H05K 1/09 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2130742

The invention relates to the miniaturization of thick film hybrid electronics assemblies used in hearing instruments. A novel method of designing the electrical termination pads for such devices allows reduction in size not otherwise possible.

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