Heat-absorbing material

Details Heat-absorbing material Heat-absorbing material

C - Chemistry, Metallurgy

09

K

31/39

C09K 5/00 (2006.01)

Patent

CA 1080460

ABSTRACT OF THE DISCLOSURE A heat absorbing material comprising between 12 and 51 wt % of boron carbide, between 7 and 22 wt % silicon carbide, between 1 and 10 wt % of copper, between 1 and 12 wt % of titanium diboride and between 79 and 5 wt % of carbon. The heat-absorbing material disclosed displays the requisite thermophysical properties, high heat resistance and low density. The thermal conductivity of the material is between 82 and 37 W/m.deg over the range of temperatures between 20 and 1000°C the specific heat is between 0.94 and 1.74 kJ/kg.deg at temperatures varying between 20 and 600°C and the density of the material is between 2.32 and 2.50 g/cm3.

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