Heat activatable adhesive or sealant compositions

Details Heat activatable adhesive or sealant compositions Heat activatable adhesive or sealant compositions

C - Chemistry, Metallurgy

08

K

117/183, 400/403

C08K 5/00 (2006.01) C08F 283/10 (2006.01) C08F 299/02 (2006.01) C08L 63/00 (2006.01) C08L 101/00 (2006.01) C09J 4/06 (2006.01) C09J 7/00 (2006.01)

Patent

CA 1194635

Abstract of the Invention A heat activatable adhesive or sealant organic resin composition comprising (1) a member of the group consisting of (a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: Image wherein R is H or CH3, R1 is an organic moiety and n is at least 2, (b) an epoxy resin containing at least Image groups and (c) a mixture of (a) and (b); (2) a thermal initiator, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene- isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene propylene diene monomer and mixtures thereof. The composition after application to the parts to be bonded or sealed forms a thermoset bond or seal on application of heat thereto, preferably by electromagnetic techniques including dielectric and induction heating.

410824

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