Heat activatable adhesive with improved temperature resistance

Details Heat activatable adhesive with improved temperature resistance Heat activatable adhesive with improved temperature resistance

C - Chemistry, Metallurgy

08

L

400/1808, 400/51

C08L 75/06 (2006.01) C08G 63/66 (2006.01) C09J 131/04 (2006.01) C09J 167/02 (2006.01) C09J 175/04 (2006.01) C09J 177/00 (2006.01) C09J 201/00 (2006.01) C08L 67/02 (2006.01) C08L 75/00 (2006.01)

Patent

CA 1165043

Abstract Thermoplastic adhesive compositions are described which comprise (a) a thermoplastic polymer, (b) an organic polymer having a plurality of functional groups available for crosslinking and (c) a crosslinking agent capable of reacting with (b). These adhesive compositions are heat activatable at low temperatures and exhibit delayed tack and improved temperature resistance. These adhesive compositions may be conveniently applied to substrates as solutions in volatile organic solvents and are particularly suitable for employment in bonding operations involving insulative materials such as thermal insulation and sound deadening insulation.

358665

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