Heat-activated adhesive

Details Heat-activated adhesive Heat-activated adhesive

C - Chemistry, Metallurgy

08

L

400/1821, 117/31

C08L 33/06 (2006.01) C08L 61/06 (2006.01) C08L 93/04 (2006.01) C09J 7/02 (2006.01) C09J 133/08 (2006.01)

Patent

CA 1147093

Abstract Heat-activated adhesive comprising a pressure- sensitive-adhesive acrylate polymer and a tackifying resin, the latter being included in sufficient amount to lower the pressure-sensitive adhesion of the complete heat-activated adhesive to levels needed for convenient and effective room-temperature handling of sheets coated with the adhe- sive, while leaving the adhesive with the capacity for strong heat-activated bonds.

367961

Affiliated with

Also associated with

Rating

Heat-activated adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-activated adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-activated adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-980537