Heat-activated contacts and assembly on printed-circuit boards

H - Electricity – 05 – K

Patent

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Details

CPC

26/139, 339/11.5

IPC codes

H05K 3/32 (2006.01) H01R 4/01 (2006.01) H01R 12/16 (2006.01) H05K 1/11 (2006.01) H05K 7/10 (2006.01)

Type

Patent

Patent number

CA 1059227

Description

A B S T R A C T It is known to solder electronic components to printed circuit boards but this makes subsequent component removal difficult. It is also known to use spring-loaded retaining sockets but these tend to form inferior electrical connections. The present invention provides a method of making connections which comprises bringing a plurality of reversibly-temperature- actuatable devices attached to a carrier into contact with the substrate, fixing the contact devices to the substrate, raising or lowering the temper- ature of the contact devices to cause them to release the carrier and then bringing a plurality of members into contact with the plurality of contact devices and raising or lowering the temperature of the contact devices to cause them to grip the members. The "reversibly-temperature-actuatable contact device" is one which will adopt a first configuration at a first temperature (released position) and a second configuration at a second temperature (gripping position).

Application Number

223841

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