Heat activated silicon-based adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

400/5330, 400/72

C09J 183/08 (2006.01) C09J 4/00 (2006.01) C09J 161/04 (2006.01)

Patent

CA 1319216

HEAT ACTIVATED SILICON-BASED ADHESIVE ABSTRACT OF THE DISCLOSURE Adhesive compositions affording strong bonds of high environmental resistance between elastomers and substrates such as metals are provided. The adhesive compositions comprise an admixture of i) olefinic organosilane, ii) water, and iii) an alumino zirconium metallo-organic complex of chelated aluminum moiety, an organofunctional ligand and zirconium oxyhalide. The adhesive composition preferably includes a polymer resin selected from phenolic-formaldehyde resins, urea-formaldehyde resins, resorcinol- formaldehyde resins or melamine-formaldehyde resins.

554517

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