C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/06 (2006.01) C08K 3/16 (2006.01) C08K 5/00 (2006.01) C08K 13/02 (2006.01) C08L 77/00 (2006.01) D01F 6/60 (2006.01)
Patent
CA 2219551
There are provided a heat-aging-resistant polyamide resin composition comprising (C) 100 wt. parts of a polyamide containing 10 to 100 % by weight of (A) a polyamide obtained by polymerizing a diamine compound containing at least 70 mole % m-xylylenediamine and a dicarboxylic acid component containing at least 70 mole % adipic acid and the rest of (H) other polyamide, (D) 0.001 to 0.1 wt. part of a copper compound, (E) 0.005 to 1 wt. part of a halide of a Group 1 or Group 2 metal of the Periodic Table, an ammonium halide, or an organo-halide at least one of (F) 0.05 to 3 wt. parts of a hindered phenol and (G) 0.05 to 3 wt. parts of a hindered amine, and (H) 0.05 to 3 wt. parts of an organophosphorus compound and a fiber made of the polyamide resin composition.
Harada Masahiro
Shida Takatoshi
Takahashi Makoto
Mitsubishi Gas Chemical Company Inc.
Smart & Biggar
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