Heat bonding method

Details Heat bonding method Heat bonding method

B - Operations, Transporting

32

B

154/71.01, 154/7

B32B 27/12 (2006.01) B29C 65/00 (2006.01) B29C 65/04 (2006.01) B29C 65/74 (2006.01)

Patent

CA 1053556

ABSTRACT OF THE DISCLOSURE Thermoplastic materials, such as polyvinylchloride, cannot normally be heat bonded to certain higher-melting synthetic fabrics, such as nylon or the like, which are of the densely woven type and are also frequently treated with silicone or analogous substances to make them water repellant and/or windproof. The present method overcomes this problem by heat-bonding such materials under pres- sure and the application of a dielectric field, and by causing suf- ficient dielectric resistance to be present at the synthetic fabric so that the dielectric field is able to heat the synthetic fabric to a temperature at which it becomes sufficiently flowable to bond with the thermoplastic material. -1-

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