Heat conducting interface for electric module

H - Electricity – 05 – K

Patent

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Details

347/5

H05K 7/20 (2006.01) F28F 13/00 (2006.01)

Patent

CA 2011487

ABSTRACT OF THE DISCLOSURE A heat conducting interface unit for use in mounting an electronic module between cooling plates, includes an elongated flexible, U-shaped, highly heat conductive metallic heat exchange member adapted to receive a condensor end of the electronic module. The heat exchange member is located within a housing which provides liquid coolant chambers on the outside walls of the heat exchange member. The coolant is supplied under pressure through inlets in the housing from corresponding ports in the cooling plates. The pressure in the coolant chamber urges the flexible metallic heat exchange member into increased contact pressure with the condensor portion of the electronic module, reducing the thermal resistance across the contact interface, increasing the rate of heat transfer to the cold plate, and clamping the module in position. The heat exchange member covers the entire surface of the condensor to maximize heat transfer. It also provides a simple structure and a short thermal path to the coolant.

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