Heat-curable bismaleimide molding compositions

Details Heat-curable bismaleimide molding compositions Heat-curable bismaleimide molding compositions

C - Chemistry, Metallurgy

08

F

C08F 22/40 (2006.01) C08F 222/40 (2006.01) C08G 73/12 (2006.01) C08K 7/02 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2067442

Heat-curable bismaleimide resins contain a bismaleimide, an aromatic dialkenyl compound as comonomer and also from 1 to 40% by weight of a monoalkenyl compound, preferably 2-hydroxy-3-allyl biphenyl, as reactive diluent.

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