Heat-curable bismaleimide resins

Details Heat-curable bismaleimide resins Heat-curable bismaleimide resins

C - Chemistry, Metallurgy

08

F

402/297

C08F 222/40 (2006.01) C08G 73/12 (2006.01) C08J 5/24 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2023666

Heat-curable bismaleimide resins containing an aromatic alkenyl compound, prefer- ably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated tempera- tures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

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