Heat curable blends of silicone polyimide and epoxy resin

Details Heat curable blends of silicone polyimide and epoxy resin Heat curable blends of silicone polyimide and epoxy resin

C - Chemistry, Metallurgy

08

L

C08L 83/08 (2006.01) C08G 59/68 (2006.01) C08L 63/00 (2006.01) C08L 83/10 (2006.01) H01B 3/40 (2006.01) H01B 3/46 (2006.01) H01L 23/498 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2087756

RD-21,189 HEAT CURABLE BLENDS OF SILICONE POLYIMIDE AND EPOXY RESIN Abstract of the Disclosure Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.

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