Heat-curable compositions

Details Heat-curable compositions Heat-curable compositions

C - Chemistry, Metallurgy

08

G

402/250, 402/43,

C08G 59/40 (2006.01) C08G 59/68 (2006.01)

Patent

CA 1209296

- 1 - HEAT-CURABLE COMPOSITIONS Abstract of the Disclosure Compositions that cure when heated comprise (A) an epoxide resin and (B) an effective amount of (i) a diaryliodosyl salt of formula Image where R1 and R2, which may be the same or different, each represents a monovalent aromatic radical of from 4 to 25 carbon atoms, such as a substituted or unsubstituted phenyl group, M represents a metal or metalloid atom, such as phosphorus or boron, X represents a halogen atom, particularly chlorine or fluorine, and n is 4, 5, or 6, and is greater by one than the valency of M or MXn- represents pentafluorohydroxoantimonate, and (ii) a catalyst for the diaryliodosyl salt which is a salt or complex of a d-block transition metal, a stannous salt, an organic peroxide, or an .alpha.-hydroxy compound. Typically, the epoxide resin (A) is a bisphenyl A diglycidyl ether, the salt (i) is diphenyliodosyl tetrafluoroborate or hexafluoro- phosphate, and the catalyst (ii) is cupric acetylacetonate or benzpinacol. - 2 - The compositions may be used in moulding materials, coatings, sealants, adhesives, composites, laminates and impregnated tapes.

436916

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