C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
31/154, 117/65
C09D 5/24 (2006.01) B41M 7/00 (2006.01) C08G 75/04 (2006.01) C09D 11/00 (2006.01) C09D 11/10 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1171268
JUL 24 1984 Abstract of the Invention This invention relates to a heat curing process and to a solventless screen printable, heat curable conductive ink composition comprising (1) an ethylenically unsaturated member of the group consisting of (a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: Image wherein R is H or CH3, R1 is an organic moiety and n is at least 2, (b) a polythiol in combination with (a) supra, (c) n polythiol in combination with a liquid ethylenically unsaturated monomer, oligomer or prepolymer of the formula: Image wherein R2 is H or CH3, R3 is an organic moiety and n is at least 2, and (d) mixtures of (a), (b) and (c), (2) A thermal initiator, and (3) an electrically conductive material. Heating of the composition in a desired pattern on a substrate results in a printed electric circuit.
391101
Ketley Arthur D.
Morgan Charles R.
Gowling Lafleur Henderson Llp
Grace (w.r.) & Co.
LandOfFree
Heat curable conductive ink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat curable conductive ink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat curable conductive ink will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1274864