Heat-curable epoxide resin compositions

Details Heat-curable epoxide resin compositions Heat-curable epoxide resin compositions

C - Chemistry, Metallurgy

08

K

402/273

C08K 5/21 (2006.01) C08G 59/40 (2006.01) C08G 59/44 (2006.01)

Patent

CA 1185046

HEAT-CURABLE EPOXIDE RESIN COMPOSITIONS ABSTRACT Epoxide resins are cured by heating with a hydroxyphenylurea of formula Image wherein R2 and R3 each represent a (cyclo)alkyl, (cyclo)alkenyl, or aralkyl group, optionally substituted by -OH, -CN, or a halogen atom, with the proviso that R may also represent -H, or R and R together with the indicated attached N atom represent a heterocyclic radical, R denotes -NH2, -NO2, -Cl, -Br, or alkyl, and p denotes zero, 1, or 2. Such hydroxyphenylureas may be used alone, as accelerators for heat-curing with other agents such as dicyandiamide, melamine, and carboxylic acid hydrazides, or may be used as the primary curing agent with promoters such as dicyandiamide, melamine, and carboxylic hydrazides.

410881

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