Heat curable epoxy-acrylate compositions

Details Heat curable epoxy-acrylate compositions Heat curable epoxy-acrylate compositions

C - Chemistry, Metallurgy

08

G

117/113, 402/250

C08G 59/40 (2006.01) B05D 3/00 (2006.01) C08F 283/10 (2006.01) C08G 59/68 (2006.01) C08G 59/72 (2006.01) C08L 63/10 (2006.01) C09D 163/00 (2006.01)

Patent

CA 1191996

Abstract of the Invention This invention relates to a heat curable composition comprising (a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: Image wherein R is H or CH3, R1 is an organic moiety and n is at least 2 r (b) an epoxy resin containing at least two Image groups, and (c) a thermal initiator member of the group consisting of (1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator, (2) a BF3 adduct, (3) a BF3 adduct in combination with a free radical initiator, and (4) dicyandiamide in combination with a free radical initiator. The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.

407010

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