Heat-curable epoxy compositions and their use in preparing...

Details Heat-curable epoxy compositions and their use in preparing... Heat-curable epoxy compositions and their use in preparing...

C - Chemistry, Metallurgy

08

L

402/254, 400/421

C08L 63/00 (2006.01) C08F 283/10 (2006.01) C08G 59/44 (2006.01) C08G 59/50 (2006.01) C08G 59/68 (2006.01)

Patent

CA 1205250

A B S T R A C T HEAT-CURABLE EPOXY COMPOSITIONS AND THEIR USE IN PREPARING FORMED ARTICLES Heat-curable compositions suitable for use in reaction injection moulding processes comprise: (1) an epoxy compound having on average more than one epoxy group per molecule; (2) an amino compound containing at least three amino hydrogen atoms per molecule, as curing agent. (3) a Group I or II metal salt, as catalyst, and (4) a polyalkylene ether glycol. An ethylenically unsaturated monomer and a peroxide free-radical initiator may also be present. The compositions may be moulded and cured by application of heat to produce formed articles.

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