Heat-curable epoxy compositions and their use in preparing...

C - Chemistry – Metallurgy – 08 – K

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402/250, 402/43,

C08K 5/09 (2006.01) C08F 283/10 (2006.01) C08G 59/42 (2006.01) C08G 59/68 (2006.01) C08L 57/00 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1200646

A B S T R A C T Heat-curable epoxy compositions comprise: (1) an epoxy compound having an average more than one epoxy group per molecule, (2) at least one unsaturated monomer selected from the group con- sisting of esters of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds allyl compounds olefins and diolefins, (3) a carboxyl-containing compound, (4) at least one epoxy curing accelerator, and (5) a free-radical curing agent. An unsaturated aromatic monomer, such as styrene, may additionally be present. The compositions may be included and cured by application of heat to produce formed articles.

428073

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