Heat curable epoxy resin compositions

Details Heat curable epoxy resin compositions Heat curable epoxy resin compositions

C - Chemistry, Metallurgy

08

L

402/1.5

C08L 63/00 (2006.01) C08G 59/68 (2006.01) C08G 65/10 (2006.01)

Patent

CA 1179092

Case 3-13091 Heat curable epoxy resin compositions Abstract of the Disclosure The invention relates to heat curable epoxy resin compositions consisting of an epoxy resin containing, on average, more than one epoxide group per molecule, an aromatic onium salt as catalyst, a copper complex compound as co-catalyst, and a light stabiliser. These compositions are less sensitive to UV irradiation and have a good shelf life at room temperature as well as a good high temperature reactivity.

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