Heat curable molding composition

Details Heat curable molding composition Heat curable molding composition

C - Chemistry, Metallurgy

08

K

400/5306, 400/57

C08K 7/18 (2006.01) C08K 3/36 (2006.01) C08K 7/20 (2006.01) C08L 63/00 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1118927

Abstract What is disclosed is an improved heat curable. molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical inorganic filler along with the normal molding compound fillers.

294424

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