Heat-curable molding compositions

Details Heat-curable molding compositions Heat-curable molding compositions

C - Chemistry, Metallurgy

08

F

402/216, 400/581

C08F 222/40 (2006.01) C08G 73/12 (2006.01)

Patent

CA 1318077

HEAT-CURABLE MOLDING COMPOSITIONS Abstract of the Disclosure Bismaleimide resin systems containing a bismaleimide and a multinuclear alkenyl and/or alkynyl arene as comonomers have improved toughness while maintaining high glass transition temperatures.

557207

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