Heat curable one package polyurethane resin composition

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 18/10 (2006.01) C08G 18/12 (2006.01) C08G 18/40 (2006.01) C08G 18/80 (2006.01) C09K 3/10 (2006.01)

Patent

CA 1234246

ABSTRACT OF THE DISCLOSURE There is disclosed a one-package solventless polyurethane resin sealant composition curable to a Shore "S" hardness of at least 60-65 by heating at 250°F. for about 30 minutes, or at higher temperatures for shorter times. The composition comprises a polyurethane prepolymer having terminal isocyanate groups, all of which are blocked by reaction with an oxime. The prepolymer is prepared by reacting an excess of an aliphatic, cycloaliphatic, arali- phatic, or aromatic polyisocyanate with at least one polyol reagent selected from the group consisting of polyether polyols and polyester polyols to give an isocyanate terminat- ed prepolymer having a molecular weight between about 3,000 and 6,000 and then blocking the isocyanate groups thereof by reaction with an oxime. The composition also comprises a polyol curing agent having at least two active hydrogen atoms per molecule and at least one filler suitable for use in elastomeric compositions.

474146

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