C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/16, 400/5308
C08G 77/20 (2006.01) C08L 83/04 (2006.01)
Patent
CA 1179093
Abstract of the Disclosure A curable organopolysiloxane composition is provided having a low viscosity in the uncured state and high physical strength in the cured state. A mixture of organopolysiloxane having silicone vinyl containing diorganopolysiloxane and silicon hydride containing siloxane is utilized in combination with a halogen containing platinum tetramer. The heat curable liquid injection moldable mixture exhibits an extended shelf life in the absence of an inhibitor at room temperature and rapidly converts to the solid cured state at 150°C.
398124
Company General Electric
Eckersley Raymond A.
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