Heat curable organopolysiloxane-organoepoxysilicon...

Details Heat curable organopolysiloxane-organoepoxysilicon... Heat curable organopolysiloxane-organoepoxysilicon...

C - Chemistry, Metallurgy

08

L

400/5317

C08L 83/04 (2006.01) C08J 3/24 (2006.01) C08K 7/00 (2006.01)

Patent

CA 1055637

ABSTRACT OF THE DISCLOSURE There is disclosed heat curable organopolysiloxane compositions which contain adhesion additives which are organosilicon compounds which contain an epoxy functional group, alkoxy groups and at least one alkyl group or low molecular weight alkenyl group or hydrogen atom bound to silicon. These compositions are useful as adhesives, sealants, coatings and wrappings on a wide variety of substratas.

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