Heat-curable reaction resin mixtures and the use thereof

Details Heat-curable reaction resin mixtures and the use thereof Heat-curable reaction resin mixtures and the use thereof

C - Chemistry, Metallurgy

08

G

C08G 18/18 (2006.01) B22C 1/22 (2006.01) C08G 18/00 (2006.01)

Patent

CA 2148782

The present invention relates to heat-curable reaction resin mixtures comprising at least one organic polyisocyanate, at least one organic compounds having epoxy rings, and mixtures of certain tertiary amines as reaction accelerators. These reaction resin mixtures are suitable as casting resins for mold making and for the production of various kinds of composites. The curing of the resins takes place in economically reasonable time periods, without excessive evolution of heat, while avoiding shrinkage and the formation of cracks and bubbles.

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