C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/5307
C08K 5/01 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) C08L 83/04 (2006.01) C08L 101/00 (2006.01)
Patent
CA 1298926
HEAT CURABLE RESIN COMPOSITION ABSTRACT The water permeability of cured thermosetting organic resin composition is reduced and the dimensional stability of these compositions during molding is improved by the addition to the curable resin composition of a finely divided, cured organosiloxane material prepared from a curable organopolysiloxane, a curing agent for the organopolysiloxane, an optional silica filler and an aromatic hydrocarbon compound containing a substituted benzene ring where the substituent is a monovalent ethylenically unsaturated hydrocarbon radical or an alkenyloxy radical.
546054
Morita Yoshitsugu
Shida Shoichi
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
Morita Yoshitsugu
Shida Shoichi
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