Heat-curable resin composition

Details Heat-curable resin composition Heat-curable resin composition

C - Chemistry, Metallurgy

08

J

C08J 3/12 (2006.01) B32B 27/26 (2006.01) C08F 290/04 (2006.01) C08F 290/06 (2006.01) C08F 291/02 (2006.01) C08F 297/02 (2006.01) C08L 51/08 (2006.01) C08L 53/00 (2006.01) C08L 63/00 (2006.01) H05K 3/28 (2006.01) C08L 19/00 (2006.01)

Patent

CA 2466611

The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.

L'invention concerne une composition de résine comprenant au moins un prépolymère bifonctionnel (A) thermodurcissable, un élastomère téléchélique et un matériau particulaire à coeur en élastomère et à enveloppe thermoplastique. Des couches et des motifs produits au moyen de la formulation de l'invention possèdent de très bonnes propriétés concernant l'adhérence, la stabilité chimique et les propriétés électriques et une résistance élevée à des changements rapides de température. Ces compositions conviennent particulièrement comme épargne de soudage dans la production de cartes de circuits imprimés.

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