Heat-curable resin mixture

Details Heat-curable resin mixture Heat-curable resin mixture

C - Chemistry, Metallurgy

08

L

400/4008, 400/50

C08L 79/08 (2006.01) C08G 59/40 (2006.01) C08G 73/06 (2006.01) C08K 5/315 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1315443

ABSTRACT OF THE DISCLOSURE: A heat-curable resin mixture is disclosed, which is based on cyanic esters and thermoplastic polymers and which, on curing, give moldings of good toughness, stiffness and heat resistance. This resin mixture contains 100 parts by weight of a polyfunctional aromatic cyanic ester; from 2 to 100 parts by weight of a monofunctional aromatic cyanic ester; from 5 to 100 parts by weight of a thermoplastic polymer having a glass transition temperature above 100°C and an average molecular weight Mn of 3,000 to 30,000 and containing reactive end groups, from 0 to 50 parts by weight of an optional bismaleimide, and from 0 to 50 parts by weight of an optional epoxy resin.

589835

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