Heat-curable, thermally expandable epoxy resin moulded part

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

C08J 9/00 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01) C08J 9/32 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2362894

The invention relates to heat-curable, thermally expandable moulded parts prepared from a mixture of at least one solid reactive resin, at least one liquid reactive resin, at least one reactive resin having a flexibilizing effect as well as curing agents and/or accelerators or blowing agents. The moulded parts are suitable for the stiffening and/or reinforcement of thin- wall metal constructions and for stiffening hollow metallic light-weight structures. In comparison with known heat-curable, thermally expandable moulded parts the moulded parts provided for by the invention are characterized by improved dimensional stability in the uncured state and lower surface tack. They are also characterized by minimum odour release during curing.

L'invention concerne des corps moulés expansibles à chaud, thermodurcissables, obtenus à partir d'un mélange comprenant au moins une résine réactive solide, au moins une résine réactive liquide, au moins une résine à action visant à rendre flexible, ainsi que des durcisseurs et/ou des activateurs ou des agents porogènes. Ces corps moulés s'utilisent pour rigidifier et/ou renforcer des constructions métalliques à parois fines, ainsi que pour rigidifier des constructions légères métalliques creuses. Comparativement aux corps moulés expansibles à chaud, thermodurcissables connus, les corps moulés selon l'invention se caractérisent par une meilleure stabilité de forme à l'état non durci, ainsi que par une faible adhésivité superficielle. Lesdits corps durcissent avec un dégagement minimal d'odeur.

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