Heat cured foundry binder systems and their uses

B - Operations – Transporting – 22 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B22C 1/22 (2006.01) B22C 9/10 (2006.01) C08K 3/20 (2006.01) C08L 61/00 (2006.01) C08L 61/06 (2006.01) C08L 29/04 (2006.01) C08L 31/04 (2006.01)

Patent

CA 2220359

A heat cured foundry binder system free of nitrogen and formaldehyde which prevents casting defects is useful in the fabrication of a mold for metal casting and comprises a furan resin and a curing catalyst composition containing water, copper aryl sulfonate, aryl sulfonic acid and a copper halide; optionally with polyvinyl alcohol, furfuryl alcohol, polyvinyl acetate and resorcinol pitch and/or bisphenol A tar.

L'invention porte sur un système de liants de fonderie thermodurcissables pour la fabrication de moules de coulage de métaux, exempts d'azote et de formaldhéyde et empêchant les défauts de moulage. Ledit système comporte une résine furanique et un catalyseur de durcissement à base d'eau, d'arylsulfonate de cuivre, d'acide arylsulfonique et d'halogénure de cuivre, éventuellement additionné d'alcool polyvinylique, d'alcool furfurylique, de polyacétate de vinyle, de poix de résorcinol, et/ou de goudron de bisphénol A.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Heat cured foundry binder systems and their uses does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat cured foundry binder systems and their uses, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat cured foundry binder systems and their uses will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1894298

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.