Heat-curing solvent-free one-component adhesive which is...

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 18/78 (2006.01) C08G 18/79 (2006.01) C08J 3/12 (2006.01) C09J 5/06 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2210272

Disclosed is a composition comprising: A) as a hardener component, a polyaddition product containing hydroxyl and uretdione groups, B) as a binder component, a hydroxyl-containing compound, and, C) optionally auxiliaries and additives. Also disclosed is the preparation of the composition and its use as a heat-curing, one-component, solvent-free polyurethane (PU) adhesive which does not give off elimination products.

Une composition est divulguée et comprend : A) en tant que composant durcisseur, un produit de polyaddition contenant des groupes d'hydroxyles et d'uretdiones, B) en tant que composant liant, un composé contenant de l'hydroxyle et C) au choix, des auxiliaires et des additifs. On divulgue également la préparation de la composition et son utilisation en tant qu'adhésif thermodurcissable à un composant, à polyuréthanes (PU) sans solvant et qui ne dégage pas de sous-produits.

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