Heat dissipation structures and method of making

C - Chemistry – Metallurgy – 09 – K

Patent

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Details

C09K 5/00 (2006.01) H01F 27/22 (2006.01) H01L 23/373 (2006.01) H02K 9/22 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2430803

A method and related structure for dissipating heat, particularly in electronic components. The method includes mixing magnetite particles and epoxy into a paste-like state, subjecting the mixture to opposing polarities of a magnetic field on opposing sides of the mixture until the epoxy hardens to urge the magnetite particles into alignment and to form elongate structures to conduct heat away from a heat source, such as an electronic component on which the epoxy is applied.

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