Heat dissipator for a dual in line integrated circuit package

Details Heat dissipator for a dual in line integrated circuit package Heat dissipator for a dual in line integrated circuit package

H - Electricity

05

K

356/113

H05K 7/20 (2006.01)

Patent

CA 1164106

ABSTRACT OF THE DISCLOSURE A heat dissipator for use with a dual in line integrated circuit package. The subject dissipator is unitary in construction and formed of a resilient material to facilitate rapid mounting and subsequent removal from an IC package. The dissipator includes a pair of opposed top and bottom contact plates interconnected by an intermediate segment. A radiator plate is provided extending upwardly from the remaining free end of the top contact plate. The dissipator may be slidably mounted on an IC package, with the bottom contact plate being in contact with the bottom wall of the package and with the top contact plate being in coplanar and contiguous relationship with the top wall of the package. By this arrangement, heat generated by the IC package during use is conducted by the top and bottom contact plates to the radiator plate for dissipating the heat and reducing the operating temperature of the package. -22-

378534

Affiliated with

Also associated with

Rating

Heat dissipator for a dual in line integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipator for a dual in line integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipator for a dual in line integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-614181