Heat dissipator for semiconductor devices

Details Heat dissipator for semiconductor devices Heat dissipator for semiconductor devices

H - Electricity

01

L

356/113

H01L 23/34 (2006.01) H01L 23/40 (2006.01)

Patent

CA 1204522

HEAT DISSIPATOR FOR SEMICONDUCTOR DEVICES Abstract of the Disclosure A heat dissipator including a thermally conductive body (20) having a face (31) adapted to contact a semiconductor (27) to be cooled, and a clip (21) for engaging the body and resiliently clamping the semiconductor device against the contact face. The clip has at least one attachment element (40, 61, 74, 85) which, like the leads (29) of the semiconductor device, projects beyond one edge (43,63) of the dissipator body, the attachment elements being used to join the body and hence the semiconductor device to a support (45), such as a printed circuit board. The clip may be formed of a solderable material which is different from the material of which the body is formed. The clip may be a single piece of bent sheet metal.

448942

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