Heat dissipator including coolant passage and method of...

H - Electricity – 01 – L

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H01L 23/46 (2006.01) H01L 23/373 (2006.01) H01L 23/473 (2006.01)

Patent

CA 2241402

A heat dissipator includes a heat-conductive substrate, a lid and a heat-conductive cover layer, and a coolant groove for passing coolant is formed on a major surface of the substrate. The lid is positioned on the coolant groove to seal the same, and the cover layer covers the major surface of substrate and the lid.

Un dissipateur thermique comprend un substrat thermoconducteur, un couvercle et une couche de couverture thermoconductrice, une gorge de refroidissement servant au passage du réfrigérant sur la surface principale du substrat. Le couvercle est placé sur la gorge de refroidissement afin de la sceller, et la couche de couverture couvre la surface principale du substrat et le couvercle.

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