Heat-moldable laminate and process for molding said...

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B32B 5/02 (2006.01) B29C 51/14 (2006.01) B29C 70/08 (2006.01) B32B 27/04 (2006.01) B32B 27/08 (2006.01)

Patent

CA 1143646

T-10-23007C/80 ABSTRACT OF THE DISCLOSURE A heat-moldable laminate comprising at least one thermoplastic resin layer, at least one fiber reinforced thermo- setting resin layer, and at least one adhesive layer interposed therebetween and bonding the resin layers, said adhesive layer comprising a thermoplastic resin and said adhesive layer being capable of being molten at lower temperatures than the moldable temperature of the thermoplastic resin layer, and a process for molding the heat-moldable laminate to produce a molded article having excellent strength and rigidity is disclosed.

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