Heat pipe cooling module for high power circuit boards

Details Heat pipe cooling module for high power circuit boards Heat pipe cooling module for high power circuit boards

H - Electricity

05

K

356/3

H05K 7/20 (2006.01)

Patent

CA 1198828

ABSTRACT A heat pipe cooling module assembly (20) for cooling electronic components (28) includes a plurality of heat pipe modules (22) comprising condenser and evaporator sections (24, 26) and working fluid therein. In a preferred embodiment, each evaporator section comprises a sandwich construction of a pair of flat outer plates (34), a pair of wick pads (36) and a separator plate (38) comprising channels extending from the evaporator section into the condenser section.

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