Heat pipe manifold system

Details Heat pipe manifold system Heat pipe manifold system

B - Operations, Transporting

29

C

18/709

B29C 45/73 (2006.01) B29C 45/27 (2006.01)

Patent

CA 1204906

HEAT PIPE MANIFOLD SYSTEM Abstract A hot manifold system for use in the injection molding of plastics is disclosed wherein runner channel heating is accomplished by heat pipes disposed within the manifold adjacent to the runner channels contained therein. The manifold system is an elongated structure having a heat receiving portion and a runner containing portion such that heat input may be applied to the heat receiving portion at an accessible location relative to the mold and conveyed to the remainder of the manifold for uniform heating thereof by the heat pipes.

433903

Affiliated with

Also associated with

Rating

Heat pipe manifold system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pipe manifold system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pipe manifold system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1277539