Heat pump apparatus and method

F - Mech Eng,Light,Heat,Weapons – 25 – B

Patent

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Details

F25B 47/02 (2006.01) F25B 30/02 (2006.01) F25B 49/02 (2006.01)

Patent

CA 2618397

A heat pump system and method is presented having a primary compressor, a booster compressor, an economizer, a microprocessor, an air temperature sensor, and a temperature sensor for sensing a temperature commensurate with the boiling temperature of refrigerant in the outside coil. The microprocessor effects controlled operation of the primary compressor, the booster compressor and the economizer when a thermostat calls for heat and in accordance with predetermined ranges of air temperature. The microprocessor calculates a defrost trigger temperature, and defrost operation is initiated when the sensed refrigerant boiling temperature is lower than the trigger temperature for a period of time.

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