G - Physics
05
D
62/25
G05D 23/00 (2006.01) F24H 4/04 (2006.01) F25B 27/02 (2006.01) F25B 29/00 (2006.01)
Patent
CA 1028863
LandOfFree
Heat pump device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat pump device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pump device will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-421024