Heat pump system

Details Heat pump system Heat pump system

F - Mech Eng,Light,Heat,Weapons

25

B

62/25

F25B 29/00 (2006.01) F25B 7/00 (2006.01) F25B 30/02 (2006.01) F25B 39/02 (2006.01) F25B 39/04 (2006.01)

Patent

CA 2022125

ABSTRACT OF THE DISCLOSURE A heat pump and a method for operating a heat pump having at least one circuit for circulation of a refrigerant, said circuit comprising a compressor, a condenser as a high- temperature heat output means, an expansion valve and a low- temperature heat output means, said method comprising the steps of employing, as the condenser, a counterflow heat exchanger having a once-through flow path and a concentrical double-tube structure, passing a fluid to be heated and a refrigerant to be cooled through the condenser in absolute countercurrent flow with each other, withdrawing a heated fluid and a cooled refrigerant from the condenser and operating said condenser to obtain a supercool degree such that the following relationship is satisfied: supercool degree 0.4 ? saturated refrigerant temperature - inlet temperature of fluid to be heated wherein supercool degree is defined as the temperature difference between the saturated refrigerant temperature and the outlet temperature of the refrigerant and the temperature difference between the saturated refrigerant temperature and the inlet temperature of the fluid to be heated is greater than or equal to 35°C, thereby enabling a high temperature hot fluid to be discharged with a large temperature difference from its inlet temperature.

Affiliated with

Also associated with

Rating

Heat pump system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pump system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pump system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2074576