Heat pump system with improved heat transfer

F - Mech Eng,Light,Heat,Weapons – 25 – B

Patent

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62/25

F25B 29/00 (2006.01) F25B 17/00 (2006.01) F28D 20/00 (2006.01) F28F 9/22 (2006.01)

Patent

CA 1045394

Abstract of the Disclosure A heat pump for cooling or heating a conditioned space includes an underground heat pipe laid into a hole in the ground back-filled with soil. The heat transfer of the soil is improved by dispersing highly water-absorbent hydrophilic polymeric gel particles soaked with water around the heat pipe. The water-soaked particles preferably are coated with a water-impermeable film. The water may also be entrapped in liquid form in small bags. Also, a water impermeable sheath may be formed around the back-fill soil to minimize evaporation from the particles. -1-

285574

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