H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/36 (2006.01) F16L 59/08 (2006.01) F28F 13/18 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2170133
A heat radiating board and a method for cooling by utilizing the same based on a novel principle of heat gradient. And, this heat radiating board, which is used by being disposed between a high temperature zone and a low temperature zone, consists of a metal plate and a heat gradient-forming layer laminated on the surface thereof facing the low temperature zone, this heat gradient-forming layer being formed from a heat conductive material having a heat volume and an absorption of heat of radiation smaller than the metal plate.
L'invention concerne une plaque de radiation dont le fonctionnement est basé sur un nouveau principe appelé gradient thermique, ainsi qu'un procédé de refroidissement utilisant ladite plaque. La plaque de radiation comprend une plaque métallique et une couche de formation d'un gradient thermique appliquée sur la surface de la plaque métallique, sur une face d'une zone de basse température, la plaque et la couche étant disposées entre une zone de haute température et la zone de basse température. La couche de formation du gradient thermique comprend un matériau thermoconducteur dont la capacité thermique et l'absorption de chaleur radiante sont plus faibles que celles de la plaque métallique.
Kujirai Masami
Kujirai Yukio
Kujirai Yumiko
Kabushiki Kaisha Sekuto Kagaku
Kirby Eades Gale Baker
Suikoh Topline Co. Ltd.
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