C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/00 (2006.01) B05D 3/00 (2006.01) B05D 5/10 (2006.01) C09D 163/00 (2006.01) C09D 179/04 (2006.01) C09J 179/00 (2006.01) C09J 179/04 (2006.01)
Patent
CA 2090560
The present invention provides a heat-resistant adhesive composition comprising mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. Said heat-resistant adhesive composition can be applied under mild conditions, has excellent heat resistance and chemical resistance, and is superior in adhesion strength particularly at high temperatures.
Amano Satoshi
Imashiro Yasuo
Ito Takahiko
Saito Kazuo
Takahashi Ikuo
Nisshinbo Industries Inc.
Smart & Biggar
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