Heat resistant adhesives

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

117/31, 400/9044

C08L 31/04 (2006.01) C08L 33/08 (2006.01) C09J 131/04 (2006.01) C09J 133/08 (2006.01)

Patent

CA 1274644

ABSTRACT OF THE DISCLOUSRE An aqueous adhesive dispersion containing, based on the total weight of the dispersion, 40 to 65% by weight of a copolymer formed by radical copolymerization of ethylene, acrylic esters having alkyl groups of 4 to 12 carbon atoms, vinyl acetate, ethylenically unsaturated carboxylic acids, ethylenically unsaturated hydroxyalkyl functional compounds, optionally (meth-)- acrylamide and, optionally, other mono- or poly-ethylenically unsaturated compounds, using emulsion polymerization and having a glass-transition temperature of from -20 to -60°C and a K value of from 50 to 180 characterized in that the copolymer was produced from a) 5 to 25% by weight of ethylene, b) 95 to 75% by weight of a comonomer mixture comprising b1) 40 to 65% by weight of acrylic ester(s), b2) 33 to 55% by weight of vinyl acetate, b3) 1 to 5% by weight of ethylenically unsaturated carboxylic acids, b4) 1 to 8% by weight of ethylenically unsaturated hydroxyalkyl functional compounds, b5) 0 to 0.8% by weight of acrylamide or methacrylamide b6) 0 to 2% by weight of other mono- or poly- ethylenically unsaturated compounds in the presence of 1 - 6% by weight, based on the comonomer mixture, of an emulsifier having excellent adhesion to a plurality of substrates at elevated temperatures.

497685

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