Heat resistant adhesives for adhering mailer windows

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 131/04 (2006.01) B42D 5/02 (2006.01) B42D 15/08 (2006.01) B65D 27/04 (2006.01) C09J 4/02 (2006.01) C09J 123/08 (2006.01)

Patent

CA 2080189

Abstract of the Disclosure A window-containing mailer is provided which is suitable for use in nonimpact printers using heated fuser rolls. A heat and moisture resistant adhesive which resists picking at temperatures encountered in the fusing rolls secures a transparent polymeric film or glassine patch to the mailer substrate. The adhesive may be either a crosslinkable aqueous-based latex or emulsion or a radiation curable composition.

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