Heat resistant microporous membrane

B - Operations – Transporting – 01 – D

Patent

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Details

B01D 69/02 (2006.01) A61M 1/02 (2006.01) B01D 67/00 (2006.01) B01D 71/34 (2006.01) B32B 5/32 (2006.01) B32B 27/00 (2006.01) C08F 14/22 (2006.01) C08J 9/26 (2006.01) H01M 2/16 (2006.01)

Patent

CA 2388246

A heat resistant microporous membrane containing a thermoplastic resin having a crystalline melting point of 140-300°C and having a layer structure formed in the direction of membrane thickness, said layer structure containing 5-100% of a layer defined by the following (A) and 95-0% of a layer defined by the following (B) : (A) a layer in which the micropores are intra-spherulitic voids, and (B) a layer in which the micropores are intra-spherulitic voids and inter-spherulitic voids.

L'invention concerne un film microporeux thermorésistant contenant une résine thermoplastique ayant un point de fusion de cristaux de 140 à 300 DEG C et présentant une structure de couche formée dans le sens de l'épaisseur, la structure de couche présentant 5 à 100 % d'une couche définie par (A) une couche ne présentant que des micropores, lesquels sont des vides à l'intérieur d'une sphérulite et 0 à 95 % d'une couche définie par (B) une couche présentant des micropores, lesquelles sont des vides à l'intérieur d'une sphérulite ainsi que des micropores lesquels sont des vides présents entre des sphérulites.

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