C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4603, 400/58
C08L 79/00 (2006.01) C08L 31/08 (2006.01) C08L 79/08 (2006.01)
Patent
CA 1047677
HEAT-RESISTANT MOLDING RESIN COMPOSITION ABSTRACT OF THE DISCLOSURE A novel heat-resistant resin composition moldable in 20 to 180 seconds at a temperature of 130° to 180°C. and excellent in mechanical strengths at high temperatures is obtained by mixing a polyamino- bismaleimide with a modifying reagent selected from the group consisting of (A) a diallyl phthalate pre- polymer and (B) a mixture thereof with at least one monomer having a polymerizable double bond and 2 to 20 carbon atoms, and an organic peroxide. In this resin composition, the low mechanical strengths at high temperatures of phenolic resins and silicone resins, which are a drawback of these resins, and the unsatisfactory curability of an unmodified polyamino- bismaleimide resin have been overcome. The present composition, therefore, is suitable for use in electrical parts, electronic parts, automobile parts, and machine parts.
242579
Aso Tetsuo
Watanabe Tsutomu
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